UV ps laser

The UV ps laser RGH-355-45 provides high power (over 50 W at 355 nm), short picosecond pulse (~7 ps), high repetition rates (up to 8 MHz), and spatial scaling: the beam can be split numerous times to simultaneously feed multiple work stations. Applications include processing of thin films/multilayer low ablation threshold substrate materials; microelectronic FPCB or SLP (substrate-like-package) cutting and drilling, OLED cutting and drilling.